Optimization  program  and  mounting  work  system

ABSTRACT

With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.

TECHNICAL FIELD

The present invention relates to a mounting work system in whichmounting work is sequentially performed on circuit substrates beingconveyed, and an optimization program that optimizes the mounting workfor each work machine in the system.

BACKGROUND ART

A mounting work system is usually provided with multiple mounting workmachines lined up, and circuit substrates are conveyed from an upstreamside of the multiple mounting work machines to a downstream side. Formounting work performed by the multiple mounting work machines withrespect to the circuit substrates, because multiple electroniccomponents are mounted on a circuit substrate, mounting work of mountingmultiple electronic components on the circuit substrate is dividedbetween each of the multiple mounting work machines. In other words,mounting procedures for mounting the multiple electronic components onthe circuit substrate (hereinafter also referred to simply as “workprocedure”) are set as work data to the multiple mounting work machines.

Further, among circuit substrates, there are circuit substrates that areprovided with multiple boards on one circuit substrate, in whichmultiple electronic circuit board patterns (hereinafter sometimesreferred to as “circuit pattern”) on which multiple electroniccomponents are to be mounted are provided; and these multiple-boardsubstrates sometimes include a circuit pattern that is not in goodcondition (hereinafter sometimes referred to as “defective circuitpattern”). For these multiple-board substrates that include a defectivecircuit pattern, mounting work to the defective circuit pattern can beskipped during mounting work, and it is desirable to improve throughputof substrate work system 10 as much as possible. For this, as disclosedin the following patent literature, development has progressed of workprocedure settings means for improving throughput when performingmounting work on multiple-board substrates that include a defectivecircuit pattern.

CITATION LIST Patent Literature

Patent Literature 1: JP-A-2011-216797

Patent Literature 2: JP-A-2009-99886

Patent Literature 1: JP-A-H5-51193

SUMMARY OF INVENTION Technical Problem

According to the technology disclosed in the above patent literature, itis possible to improve to some extent the throughput when performingmounting work on multiple-board substrates that include a defectivecircuit pattern. However, it is desirable to further improve throughput.The present invention takes account of such circumstances and an objectthereof is to further improve the throughput when performing mountingwork on multiple-board substrates that include a defective circuitpattern.

Solution to Problem

To solve the above problems, disclosed in claim 1 is an optimizationprogram for optimizing work of mounting electronic components,including: a setting means that sets a mounting work procedure ofmounting electronic components to an electronic circuit board patternfor each of multiple mounting work machines such that mounting work ofmultiple components to each of multiple of the electronic circuit boardpatterns is performed by all of the multiple mounting work machines, theoptimization program being for a mounting work system provided withmultiple of the mounting work machines lined up in a row, withmultiple-board printed panels being conveyed in the mounting work systemfrom an upstream side of the multiple mounting work machines to adownstream side, the multiple-board printed panel being defined as apanel with multiple boards provided with an electronic circuit boardpattern to be mounted with multiple of the electronic components.

The optimization program disclosed in claim 2 is the optimizationprogram according to claim 1, wherein the setting means sets themounting work procedure of mounting electronic components to theelectronic circuit board pattern for each of the multiple mounting workmachines such that the total time for work of mounting the electroniccomponents to the electronic circuit board pattern is equalized for eachof the multiple mounting work machines.

The optimization program disclosed in claim 3 is the optimizationprogram according to claim 1 or 2, wherein the setting means sets themounting work procedure of mounting electronic components to theelectronic circuit board pattern for each of the multiple mounting workmachines according to the quantity of electronic components per unit oftime to be mounted to the electronic circuit board pattern by each ofthe multiple mounting work machines.

Disclosed in claim 4 is a mounting work system including: multiplemounting work machines lined up in a row; and a control device thatcontrols operation of the multiple mounting work machines, whereinmultiple-board printed panels are conveyed in the mounting work systemfrom an upstream side of the multiple mounting work machines to adownstream side, the multiple-board printed panel being defined as apanel with multiple boards provided with an electronic circuit boardpattern to be mounted with multiple of the electronic component, andwherein the control device controls operation of the multiple mountingwork machines such that the electronic components are mounted theelectronic circuit board pattern according to a mounting work procedureof mounting electronic components to the electronic circuit boardpattern for each of the multiple mounting work machines such that workof mounting the multiple electronic components of each of the multipleelectronic circuit board patterns is performed by all of the multiplemounting work machines.

Advantageous Effects of Invention

With the optimization program disclosed in claim 1 and the mounting worksystem disclosed in claim 4, the mounting work procedure of mountingelectronic components to an electronic circuit board pattern for each ofmultiple mounting work machines is set such that work of mountingmultiple electronic components onto each of the multiple electroniccircuit board patterns is performed by all of the multiple mounting workmachines. Accordingly, in a case in which mounting work onto a defectivecircuit pattern is not performed, for all of the mounting work machines,the time required for mounting by the mounting work machine is reducedby the time required for mounting work of the defective circuit pattern,thus the throughput of substrate work system 10 is improved.

Further, with the optimization program disclosed in claim 2, themounting work procedure of mounting electronic components to theelectronic circuit board pattern for each of the multiple mounting workmachines is set such that the total time for work of mounting theelectronic components to the electronic circuit board pattern isequalized for each of the multiple mounting work machines. By this, itis possible to virtually eliminate waiting time of the mounting workmachines that arises due to not performing mounting work to defectivecircuit patterns, thus significantly improving the throughput ofsubstrate work system 10.

Further, with the optimization program disclosed in claim 3, themounting work procedure of mounting electronic components to theelectronic circuit board pattern for each of the multiple mounting workmachines is set according to the quantity of electronic components perunit of time to be mounted to the electronic circuit board pattern byeach of the multiple mounting work machines. By this, a larger amount ofthe work procedure is set to be performed by mounting work machines withhigh mounting performance, and a smaller amount of the work procedure isset to be performed by mounting work machines with low mountingperformance, thus the time required for mounting work of each of themultiple mounting work machines is equalized.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view showing a substrate work system that is anembodiment of the present invention.

FIG. 2 is a perspective view showing a mounting device of the substratework system of FIG. 1.

FIG. 3 is a block diagram showing a control device of the substrate worksystem.

FIG. 4 is a plan view of a multiple-board substrate.

FIG. 5 is a conceptual diagram showing the method for setting themounting work procedure for multiple mounters when mounting electroniccomponents to multiple-board substrates.

FIG. 6 is a plan view showing a multiple-board substrate for whichmounting work is to be performed according to the mounting workprocedure set by the method shown in FIG. 5.

FIG. 7 is a conceptual diagram showing the method for setting themounting work procedure for multiple mounters when mounting electroniccomponents to multiple-board substrates.

FIG. 8 is a plan view showing a multiple-board substrate for whichmounting work is to be performed according to the mounting workprocedure set by the method shown in FIG. 7.

FIG. 9 shows the work time and reduction ratio when mounting work isperformed according to the mounting work procedure set by a conventionalmethod.

FIG. 10 shows the work time and reduction ratio when mounting work isperformed according to the mounting work procedure set by a method ofthis invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

The following describes in detail referring to the figures an exampleembodiment of the present invention.

Configuration of Substrate Work System

FIG. 1 shows substrate work system 10. System 10 shown in FIG. 1 is formounting electronic components on a circuit substrate. Substrate worksystem 10 is configured from four electronic component mounting devices(hereinafter sometimes referred to as “mounting devices”) 12. The fourmounting devices 12 are in a line adjacent to each other. In thefollowing description, the X-axis direction refers to the direction inwhich mounting devices 12 are lined up, and the Y-axis direction refersto the horizontal direction orthogonal to the X-axis direction.

The four mounting devices 12 have substantially the same configuration.For this reason, one of the four mounting devices 12 will be describedas an example. As shown in FIG. 2, mounting device 12 includes systembase 14, and two mounters 16 arranged adjacent to each other on systembase 14. Each mounter 16 primarily includes mounter body 20, conveyancedevice 22, mounting head 24, mounting head moving device (hereinaftersometimes abbreviated to “moving device”) 26, and supply device 28.Mounter body 20 is configured from frame 30 and beam 32 that is mountedon the frame 30.

Conveyance device 22 is provided with two conveyor devices 40 and 42.The two conveyor devices 40 and 42 are parallel to each other and areprovided on frame 30 extending in the X-axis direction. Each of the twoconveyor devices 40 and 42 conveys circuit substrates held by conveyordevice 40 and 42 in the X-axis direction using electromagnetic motor(refer to FIG. 3) 46. Also, the circuit substrate is fixedly held at apredetermined position by board holding device (refer to FIG. 3) 48.

Moving device 26 is an XY robot type moving device. Moving device 26 isprovided with electromagnetic motor (refer to FIG. 3) 52 that slidesslider 50 in the X-axis direction, and electromagnetic motor (refer toFIG. 3) 54 that slides slider 50 in the Y-axis direction. Mounting head24 is attached to slider 50, and mounting head 24 is moved to anyposition on frame 30 by the operation of the two electromagnetic motors52 and 54.

Supply device 28 is a feeder type supply device and is provided on thefront end of frame 30. Supply device 28 has tape feeders 70. Tapefeeders 70 house taped components in a wound state. Taped components areelectronic components that have been put into tape. Tape feeders 70deliver the taped components using indexing device (refer to FIG. 3) 76.Accordingly, feeder type supply device 28 supplies an electroniccomponent to a supply position through the feeding delivery of the tapedcomponents. Tape feeders 70 can be removed from and attached to frame 30to facilitate the exchange of electronic components and so on.

Mounting head 24 mounts electronic components on a circuit substrate.Mounting head 24 includes suction nozzle 78 that is provided on a lowerend face of the mounting head. Suction nozzle 78 is connected topositive/negative pressure supply device (refer to FIG. 3) 80 via anegative pressure air/positive pressure air supply passage. Suctionnozzle 78 picks up and holds an electronic component using negativepressure, and releases the held electronic component using positivepressure. Also, mounting head 24 has nozzle raising/lowering device(refer to FIG. 3) 82 that raises/lowers suction nozzle 78. Mounting head24 changes the position of the held electronic component in a verticaldirection by nozzle raising/lowering device 82. Note that, suctionnozzles 78 can be attached to and removed from mounting head 24, and canbe changed based on things such as the size and shape of the electroniccomponents.

Also, as shown in FIG. 3, substrate work system 10 is provided withcontrol device 90. Control device 90 is provided with controller 92 andmultiple drive circuits 96. Multiple drive circuits 96 are connected toelectromagnetic motors 46, 52, and 54, substrate holding device 48,indexing device 76, positive/negative pressure supply device 80, andnozzle raising/lowering device 82. Controller 92 is provided with a CPU,ROM, RAM, and so on, is formed mainly from a computer, and is connectedto the multiple drive circuits 96. By this, operation of conveyancedevice 22, moving device 26, and so on is controlled by controller 92.

Mounting Work by the Substrate Work System

In substrate work system 10 configured as above, circuit substrates areconveyed by conveyance device 22 inside the eight mounters 16, andelectronic components are mounted on the circuit substrates by eachmounter 16.

Specifically, first, a circuit substrate is loaded into the mounter 16arranged at the most upstream position of the eight mounters 16. Then,based on commands of controller 92, the circuit substrate is conveyed toa work position, and fixedly held at that position by substrate holdingdevice 48. Also, based on commands of controller 92, tape feeders 70feed taped components and supply electronic components to supplypositions. Then, based on commands of controller 92, mounting head 24moves above the supply position of the electronic component and picks upand holds the electronic component using suction nozzle 78. Continuing,mounting head 24 moves above the circuit substrate and mounts the heldelectronic component on the circuit substrate. When work of mountingelectronic components on the circuit substrate is complete, the circuitsubstrate is conveyed downstream and loaded into mounter 16 positionedon the downstream side. The above work is performed consecutively ateach mounter 16 to produce circuit substrates mounted with electroniccomponents.

Setting mounting work procedure for multiple-board substrates Withsubstrate work system 10, production of circuit substrates is performedaccording to the above procedure; because multiple electronic componentsare mounted on a circuit substrate, mounting work of mounting multipleelectronic components on the circuit substrate is divided between eachof the multiple mounters 16 that configure substrate work system 10. Inother words, mounting procedures for mounting the multiple electroniccomponents on the circuit substrate (hereinafter also referred to simplyas “mounting procedure”) are set as work data to the multiple mounters16. Described below is a work procedure when a circuit substrate beingproduced is a multiple-board substrate. Multiple-board substrates areprovided with multiple boards on one circuit substrate, in whichmultiple electronic circuit board patterns (hereinafter referred to as“circuit pattern”) on which multiple electronic components are to bemounted are provided; specifically, for example, on multiple-boardsubstrate 100 shown in FIG. 4, there are three circuit patterns 102,with nine electronic components 104 mounted on each circuit pattern 102.

Substrate work system 10 includes eight mounters 16; to describe settinga work procedure to the eight mounters 16 would be very complex, sodescription is given of setting a work procedure for three mounters 16that perform mounting work with respect to multiple-board substrate 100.To distinguish between the three mounters 16, they are sometimesreferred to as first mounter 16 a, second mounter 16 b, and thirdmounter 16 c. Also, to distinguish between the three circuit patterns102, they are sometimes referred to as first circuit pattern 102 a,second circuit pattern 102 b, and third circuit pattern 102 c. Further,to distinguish between the nine electronic components 104, they aresometimes referred to as first electronic component 104 a, secondelectronic component 104 b, third electronic component 104 c, fourthelectronic component 104 d, fifth electronic component 104 e, sixthelectronic component 104 f, seventh electronic component 104 g, eighthelectronic component 104 h, and ninth electronic component 104 i.

When setting a work procedure of multiple-board substrate 100 providedwith three circuit patterns 102 for three mounters 16, for example, awork procedure for nine electronic components 104 to first circuitpattern 102 a may be set to first mounter 16 a, a work procedure fornine electronic components 104 to second circuit pattern 102 b may beset to second mounter 16 b, and a work procedure for nine electroniccomponents 104 to third circuit pattern 102 c may be set to firstmounter 16 c. That is, a work procedure for electronic componentssurrounded by the dashed line in FIG. 4 may be set to first mounter 16a, a work procedure for electronic components surrounded by thesingle-dashed solid line in FIG. 4 may be set to second mounter 16 b,and a work procedure for electronic components surrounded by thedouble-dashed solid line in FIG. 4 may be set to third mounter 16. Bysetting work procedures to the three mounters 16 in this manner, thework range for each mounter 16 is made small, thus improving throughput.

However, there are cases in which one or more of the three circuitpatterns 102 of multiple-board substrate 100 is a defective circuitpattern. In this case, mounting work is not performed with respect todefective circuit pattern (hereinafter sometimes referred to as“defective circuit pattern) 102. That is, in a case in which secondcircuit pattern 102 is a defective circuit pattern, mounting work isperformed by first mounter 16 a and third mounter 16 c without beingperformed by second mounter 16 b. Thus, the throughput of substrate worksystem 10 can be thought to improve due to mounting work not beingperformed by second mounter 16 b. However, because circuit boards areconsecutively loaded into substrate work system 10, an upstream mounter16 cannot convey a new circuit substrate to a downstream mounter 16until the downstream mounter 16 has completed mounting work. That is,even though mounting work is not being performed by second mounter 16 b,second mounter 16 b cannot convey a new circuit substrate to thirdmounter 16 c until mounting work by third mounter 16 c has beencompleted, and thus second mounter 16 b is in a standby state. In suchcases, because second mounter 16 b is in a standby state in cases inwhich mounting work is not performed by second mounter 16 b due to thepresence of a defective circuit pattern, the throughput of substratework system 10 basically does not improve.

Considering this, with substrate work system 10, when there is adefective circuit pattern, setting of a work procedure is performed suchthat throughput of substrate work system 10 improves. Specifically, allwork procedures with respect to multiple-board substrate 100 are dividedby each circuit pattern 102. Accordingly, as shown in FIG. 5A, workprocedures are divided into three groups. Note that, “X-th circuitpattern (1-9)” indicates the work procedures for first electroniccomponent 104 a to ninth electronic component 104 i scheduled to bemounted on each circuit pattern 102. That is, “first circuit pattern(1-9)” indicates the work procedures for first electronic component 104a to ninth electronic component 104 i scheduled to be mounted on firstcircuit pattern 102 a.

Next, work procedures for each circuit pattern 102 are divided equallybetween all of the mounters 16 that are to perform mounting work, inthis case, three mounters 16. By this, as shown in FIG. 5B, nine workprocedures for each circuit pattern 102 are divided into three groups,and each group contains three work procedures. Note that, “X-th circuitpattern (1-3)” in the figure indicates the work procedures for firstelectronic component 104 a to third electronic component 104 c scheduledto be mounted on each circuit pattern 102, “X-th circuit pattern (4-6)”in the figure indicates the work procedures for fourth electroniccomponent 104 d to sixth electronic component 104 f scheduled to bemounted on each circuit pattern 102, and “X-th circuit pattern (6-9)” inthe figure indicates the work procedures for seventh electroniccomponent 104 g to ninth electronic component 104 i scheduled to bemounted on each circuit pattern 102.

Further, work procedures of each circuit pattern 102 divided into threegroups are distributed between the three mounters 16. Here, workprocedures from each circuit pattern 102 are distributed betweenmounters 16 such that mounting positions of electronic components 104are shared. By this, as shown in FIG. 5C, the work procedures for firstelectronic component 104 a to third electronic component 104 c scheduledto be mounted on each circuit pattern 102 are set to first mounter 16 a,the work procedures for fourth electronic component 104 d to sixthelectronic component 104 f scheduled to be mounted on each circuitpattern 102 are set to second mounter 16 b, and the work procedures forseventh electronic component 104 g to ninth electronic component 104 ischeduled to be mounted on each circuit pattern 102 are set to thirdmounter 16 c.

When setting work procedures in this manner, as shown in FIG. 6, workprocedures for first electronic component 104 a to third electroniccomponent 104 c surrounded by the dashed lines in FIG. 6 correspond tomounting work by first mounter 16 a, work procedures for fourthelectronic component 104 d to sixth electronic component 104 fsurrounded by the single-dashed solid lines in FIG. 6 correspond tomounting work by second mounter 16 b, and work procedures for seventhelectronic component 104 g to ninth electronic component 104 isurrounded by the double-dashed solid lines in FIG. 6 correspond tomounting work by third mounter 16 c. That is, each mounting work for themultiple electronic components 104 for each circuit pattern 102 isperformed by all the mounters 16.

In this manner, when setting work procedures for a multiple-boardsubstrate 100, if a defective circuit pattern is present on amultiple-board substrate 100, the throughput of substrate work system 10improves by not performing mounting work with respect to the defectivecircuit pattern. Specifically, for example, in a case in which secondcircuit pattern 102 b is a defective circuit pattern, first mounter 16 aperforms mounting work for first electronic component 104 a to thirdelectronic component 104 c for first circuit pattern 102 a and thirdcircuit pattern 104 c without performing mounting work for firstelectronic component 104 a to third electronic component 104 c forsecond circuit pattern 102 b. Also, second mounter 16 b performsmounting work for fourth electronic component 104 d to sixth electroniccomponent 104 f for first circuit pattern 102 a and third circuitpattern 104 c without performing mounting work for fourth electroniccomponent 104 d to sixth electronic component 104 f for second circuitpattern 102 b. Also, third mounter 16 b performs mounting work forseventh electronic component 104 g to ninth electronic component 104 ifor first circuit pattern 102 a and third circuit pattern 104 c withoutperforming mounting work for seventh electronic component 104 g to ninthelectronic component 104 i for second circuit pattern 102 b. That is, ateach mounter 16, mounting work is performed for first circuit pattern102 a and third circuit pattern 102 c, and mounting work is notperformed for second circuit pattern 102 b. Thus, theoretically, thetact time of substrate work system 10 is reduced by the work timerequired for second circuit pattern 102 b. In this manner, in substratework system 10, work procedures are set such that mounting work ofmounting multiple electronic components 104 for each circuit pattern 102is performed by all mounters 16, thereby improving throughput in casesin which there is a defective circuit pattern on a multiple-boardsubstrate 100.

Also, when setting work procedures as above, work procedures for eachcircuit pattern are divided and divided work procedures are distributedbetween the multiple mounters 16; however, it is possible to set workprocedures by a different method. Specifically, from all the workprocedures for multiple-board substrate 100, information related tomounting positions of electronic components to be mounted according tothe work procedures (hereinafter sometimes referred to as “referenceinformation”) and information related to circuit pattern 102 that is thetarget for mounting work according to the work procedures (hereinaftersometimes referred to as “circuit pattern information”) may be combinedand extracted. This combination of extracted reference information andcircuit pattern information is shown in FIG. 7A.

“R1-9 (1-3)” in the figure represents a combination of extractedreference information and circuit pattern information. Notation R1˜9represents reference information; for example, R1 represents theelectronic component to be mounted according to the work procedures thatis first electronic component 104 a, and the position at which firstelectronic component 104 a is to be mounted. Also, (1˜3) representscircuit pattern information; for example, (1) represents first circuitpattern 102 a that is the target for mounting work according to the workprocedures. Thus, for example, R1(1) represents the work procedure formounting an electronic component at the mounting position for firstelectronic component 104 a of first circuit pattern 102 a.

When a combination of reference information and circuit patterninformation is extracted, that information is classified by each pieceof reference information. By this, as shown in FIG. 7B, division intonine groups, R1 to R9, is performed. Then, each of the nine groups ofreference information is allocated to the three mounters 16. Here, ifthe mounting performance of the three mounters 16 is the same, each ofthe nine groups of reference information should be distributed equallybetween the mounters 16. That is, three groups each should bedistributed to each mounter 16. However, if the mounting performance ofeach mounter 16 is different, each of the nine groups of referenceinformation should be distributed between the three mounters 16 based onthe mounting performance of the mounters 16.

In detail, in a case in which the mounting performance of first mounter16 a, that is, the quantity of electronic components that can be mountedper unit of time is A components per second, the mounting performance ofsecond mounter 16 b is 2A components per second, and the mountingperformance of third mounter 16 c is 6A components per second, the ninegroups are distributed between the three mounters 16 with a ratio of1:2:6. By this, as shown in FIG. 7C, the work procedures for firstelectronic component 104 a scheduled to be mounted on each circuitpattern 102 are set to first mounter 16 a, the work procedures forsecond electronic component 104 b and third electronic component 104 cscheduled to be mounted on each circuit pattern 102 are set to secondmounter 16 b, and the work procedures for fourth electronic component104 d to ninth electronic component 104 i scheduled to be mounted oneach circuit pattern 102 are set to third mounter 16 c.

When setting work procedures in this manner, as shown in FIG. 8, workprocedures for first electronic components 104 a surrounded by thedashed lines in FIG. 8 correspond to mounting work by first mounter 16a, work procedures for second electronic components 104 b and thirdelectronic components 104 c surrounded by the single-dashed solid linesin FIG. 8 correspond to mounting work by second mounter 16 b, and workprocedures for fourth electronic components 104 d to ninth electroniccomponents 104 i surrounded by the double-dashed solid lines in FIG. 8correspond to mounting work by third mounter 16 c.

The same effects are achieved by setting work procedures in this manneras for the work procedures described earlier. Further, with this settingof work procedures, the mounting performance of mounters 16 isconsidered. Thus, for example, even in a case in which substrate worksystem 10 is configured from multiple types of mounters, it is possibleto substantially equalize the time required for work for each mounter16, thus shortening the tact time of substrate work system 10.

Note that, according to the above setting of work procedures, the effectof improving the throughput when there is a defective circuit pattern onmultiple-board substrate 100 should be quantified, thus the applicantcalculated the time required to manufacture one multiple-board substrate(hereinafter sometimes referred to as “work time”) via simulation. Shownin FIG. 9 are the work times in a case when setting work proceduresaccording to a conventional method, that is, as shown in FIG. 4, whensetting work procedures such that mounting work of one circuit pattern102 is performed by one mounter 16. Shown in FIG. 10 are the work timesin a case when setting work procedures according to a method used bysubstrate work system 10, that is, as shown in FIGS. 6 and 8, whensetting work procedures such that mounting work of each circuit pattern102 is performed by all the mounters 16.

In the figures, work times are displayed for mounting work for fivedifferent types of electronic component mounting (JOB1 to JOB5), withthe work times displayed for each of the top surfaces (Top) and bottomsurfaces (Bottom). The “No defective circuit patterns” column shows thework time in a case in which all three circuit patterns 102 onmultiple-board substrate 100 are of good condition. The “X-th circuitpattern defective” columns show the work time in a case in which theX-th circuit pattern of the three circuit patterns 102 on multiple-boardsubstrate 100 is defective. The “Average” column shows the average valueof the work times for cases in which there is a defective circuitpattern. Finally, the “Reduction ratio” shows the reduction ratio of thework time when there is a defective circuit pattern. The larger thereduction ratio, the shorter the work time is in a case when there is adefective circuit pattern compared to a case when there is no defectivecircuit pattern, meaning that the throughput when there is a defectivecircuit pattern improves. Reduction ratio A is calculated as givenbelow. A={(“work time when there is no defective circuitpattern”−“average work time when there is a defective circuitpattern”)/“work time when there is no defective circuit pattern”}×100

As shown in the figures, when settings work procedures according to aconventional method, reduction ratios are approximately 3 to 11%. On theother hand, when setting work procedures according to a method used bysubstrate work system 10, reduction ratios are approximately 24 to 33%.In this manner, by setting work procedures according to a method used bysubstrate work system 10, throughput when there is a defective circuitpattern is substantially improved.

Note that, the above setting of work procedures is performed byoptimization program (refer to FIG. 3) 110 memorized in controller 92.As shown in FIG. 3, optimization program 110 has setting means 112 thatfunctions as a section for performing setting of work procedures foreach mounter 16.

Note that, in the above embodiment, substrate work system 10 is anexample of a substrate work system. Mounter 16 is an example of amounting work machine. Control device 90 is an example of a controldevice. Multiple-board substrate 100 is an example of a multiple-boardprinted panel. Circuit pattern 102 is an example of an electroniccircuit board pattern. Optimization program 110 is an example of anoptimization program. Setting means 112 is an example of a settingmeans.

Further, the present invention is not limited to the above exampleembodiments, and various changed or improved methods of embodiment arepossible based on the knowledge of someone skilled in the art.Specifically, for example, in the above embodiment, optimization program110 is provided in control device 90 that controls operations ofsubstrate work system 10 and control device 90 performs setting of workprocedures, however, optimization program 110 may be provided in adevice different to control device 90, and setting of work proceduresmay be performed by the different device.

REFERENCE SIGNS LIST

10: substrate work system (mounting work system); 16: mounter (mountingwork machine); 90: control device (memory device); 100: multiple-boardsubstrate (multiple-board printed panel); 102: circuit pattern(electronic circuit board pattern); 110: optimization program; 112:setting means

1. An optimization program for optimizing work of mounting electroniccomponents, comprising: a setting device that sets a mounting workprocedure of mounting electronic components to an electronic circuitboard pattern for each of multiple mounting work machines such thatmounting work of multiple components to each of multiple of theelectronic circuit board patterns is performed by all of the multiplemounting work machines, the optimization program being for a mountingwork system provided with multiple of the mounting work machines linedup in row, with multiple-board printed panels being conveyed in themounting work system from an upstream side of the multiple mounting workmachines to a downstream side, and the multiple-board printed panelbeing defined as a panel with multiple boards provided with anelectronic circuit board pattern to be mounted with multiple of theelectronic components.
 2. The optimization program according to claim 1,wherein the setting device sets the mounting work procedure of mountingelectronic components to the electronic circuit board pattern for eachof the multiple mounting work machines such that the total time for workof mounting the electronic components to the electronic circuit boardpattern is equalized for each of the multiple mounting work machines. 3.The optimization program according to claim 1, wherein the settingdevice sets the mounting work procedure of mounting electroniccomponents to the electronic circuit board pattern for each of themultiple mounting work machines according to the quantity of electroniccomponents per unit of time to be mounted to the electronic circuitboard pattern by each of the multiple mounting work machines.
 4. Amounting work system comprising: multiple mounting work machines linedup in a row; and a control device that controls operation of themultiple mounting work machines, wherein multiple-board printed panelsare conveyed in the mounting work system from an upstream side of themultiple mounting work machines to a downstream side, the multiple-boardprinted panel being defined as a panel with multiple boards providedwith an electronic circuit board pattern to be mounted with multiple ofthe electronic component, and wherein the control device controlsoperation of the multiple mounting work machines such that theelectronic components are mounted the electronic circuit board patternaccording to a mounting work procedure of mounting electronic componentsto the electronic circuit board pattern for each of the multiplemounting work machines such that work of mounting the multipleelectronic components of each of the multiple electronic circuit boardpatterns is performed by all of the multiple mounting work machines.